Sergii P.

Embedded Firmware Engineer | Senior Firmware Developer | PCB designer

✅ 100% Client Recommendation ✅ Top Embedded and Firmware developer ✅ Top Hardware designer ✅ Top Software design ✅ Top Mechanical design and industrial design ✅ Top Enclosure design Services: 1) Hardware/Electronics design (Power, Analog, Digital/High-speed and RF electronics design) 2) Precertification testing (EMI, ESD, EMC, FCC, CE, UL) 3) Firmware design С/C++ (Bare metal MCU/MPU, FreeRTOS, Zephyr RTOS, Embedded Linux, Wireless protocols, Security, Interfaces, etc) 4) Industrial and Mechanical design (Enclosure design, 3D printing, IP standards, Prepare all for injection molding, etc) 5) UX/UI design (Embedded devices with displays, Mobile and Desktop applications) 6) Software design (Android, IOS, Linux kernel and user space development) 7) Embedded Quality Assurance(QA) and testing 8) Manual verification/testing PCB/FPC, functional and unit testing of the Firmware/Software, stress testing, temperature range testing Service->Hardware design service: - Power electronics design: (PFC, Solar charging controller, chargers, high voltage control, Motor controllers DC/AC/BLDC ) - Analog electronics design: High-accuracy analog measurements, Noise filtration, Digital to analog conversion, Amplifying signal - Digital and high-speed electronics design: - Memories DDRx/LPDDRx, SDRAM, Camera and display interfaces (MIPI-DSI, MIPI-CSI, DisplayPort, etc), Data communication interfaces (QSpi, SPI, UART, I2C, FMC, I2S, USB 2/3.x, etc), ( - RF Designs: ( 50-60 GHz (Radars), 1-6 GHz (UWB, Wifi, BLE, ZigBee, GPS, NB-IoT, LTE-M/LTE, Z-Wave, etc), 13,6 MHz, 128 kHz (NFC, RFID, etc), 433 MHz (Custom protocols) Service->Industrial and Mechanical design - Industrial design of the sketch - it includes a few sketch designs, depending on the physical sizes of the device, specific of industry and user experience - Mechnical CAD design with deep PCB integration - it includes full mechanical draw based on the industrial design with detailed sizes, materials and manufacturing specific. - Thermal calculation and simulation - it includes simulation of the heating device inside enclosure, with theoretical cooling calculation - 3D printing and verification - we use 3D printer hp jet fusion 5210, with a very nice quality of printing, that helps us to make a good verification of parts with PCBs - Injection molding - the last step, which includes manufacturing optimization and making pres forms, preparing documentation for the manufacturing Service->Firmware design С/C++: - Languages: C/C++, Assembler - Diagrams: Block, UML, Workflow, APIs - Interfaces: I2S, SAI, MIPI-DSI, MIPI-CSI, USB 2/3.x, LTDC, DDR3/DDR4/LPDDR4, I2C, SPI/QSPI, UART, CAN, Ethernet - Wireless: NB-IoT, LTE M, GPRS, GPS, LTE, UWB, WiFi, BLE, ZigBee, Z-Wave, LoRa, Thread, 6LoWPAN, Sub 1GHz, NFC (13,6 MHz), RFID 433 MHZ and 128 kHz - Protocols : MQTT, HTTP, FTP, Modbus TCP/RTU, SNMP, TCP/IP, UDP/IP, DLMS, custom protocols - Security: AES, SSL/TLS, custom algorithms - Libs and frameworks: TouchGFX (GUI lib for MCU), emWin (GUI lib for MCU), LVGL (GUI lib for MCU), WolfSSL (SSL/TLS), Mbed TLS(SSL/TLS), osxMotionFX (Sensors fusion algorithm based on the Kalman theory), FatFS, lwIP (TCP/IP stack), WICED (Wifi stack), aws/amazon-freertos, Paho MQTT, TensorFlow - Embedded OS: FreeRTOS, TI-RTOS, ZephyrOs, Embedded Linux, Yocto, ROS - MCUs: NXP (i.MX RT1064, LPC1100, LPC4000), Nordic (NRF52xx/NRF53xx/NRF91xx), TI (CC3220/CC26xx/CC1100/CC3200, MSP430), Espressif (esp32, esp8266), ST(STM32H7/F7/F4/L4/F0/L0/WB/WL/G0 and STM8), Atmel/Microchip(SAM D20/D21/L21/R21/V70/V71, SAMA5/SAM4/SAMD4), Silicon Labs(EFR32, ZGM130S), Cypress (PSoC 3/PSoC 4), Kinetis (Family MK81FN256VDC15), Holtek (HT68xx) - MPUs: Analog Devices (ADSP-2156x SHARC), Qualcomm (Snapdragon 625/425/610/845), Allwinner (A64, A33, H3, H6 series), NXP (I.MX6/I.MX7/I.M8) , ST(STM32MP1) - SOMs: NVIDIA Jetson nano, NVIDIA Jetson Orin Nano, NVIDIA Jetson AGX Orin, Toradex (Colibri iMX6, IMX7, IMX8), Raspberry pi (CM3, CM4 modules), Inforce (Qualcomm Snapdragon 410, 820, 845 SOM), 8devices (Mango on Qualcomm IPQ6000/IPQ6010 Soc), Sensiedge(SensiBle 1 and 2, SensiLora) Service->Software: - Languages: Java, Kotlin, C#, C/C++, Python, Java Script - Diagrams: Block, UML, Workflow, APIs - Interfaces: USB, Ethernet - Protocols : MQTT, HTTP, FTP, Modbus TCP/RTU, SNMP, TCP/IP, UDP/IP, DLMS, custom protocols - Wireless: BLE, WiFi, UWB - Security: AES, SSL/TLS - Libs and frameworks: GStreamer, Paho MQTT, WolfSSL (SSL/TLS), Mbed TLS(SSL/TLS), QT framework, Xamarin Forms and Maui, ASP .NET Core and web development, React (web UI development), SQLite DB, FireBase DB, Mong DB, InfuxDB DB, Room, TensorFlow, Node.js - OS: Android, IOS, Linux, Windows